Overview
Macquarie has identified a group of Taiwan technology companies that, in its assessment, stand to benefit from increased demand for AI-focused chips and next-generation server infrastructure. The brokerage's analysis emphasizes exposure to AI chip manufacturing, high-performance computing (HPC) workloads, and the ancillary hardware and networking components required to support scale-up AI systems.
Company-by-company analysis
TSMC - Taiwan Semiconductor Manufacturing Company remains Macquarie's top selection. The firm points to TSMC's leading role in high-performance computing, noting that the company's exposure to HPC reached over 60% in the first quarter of 2026. Macquarie highlights TSMC's market leadership in both front-end advanced nodes and back-end advanced packaging for AI chip production. The brokerage underscores that TSMC provides a combined front-end and back-end service model, effectively offering clients a one-stop turnkey solution that it says differentiates the foundry from competitors.
MediaTek - Macquarie ranks MediaTek second, based on the company's strategic pivot toward AI application-specific integrated circuits. The brokerage estimates that MediaTek's AI ASIC business is scaling rapidly and projects that it will exceed the company's smartphone revenue by 2027. Macquarie projects the AI ASIC segment to contribute roughly $12 billion, representing about 40% of MediaTek's total revenue at that point.
eMemory - Macquarie calls out eMemory as a beneficiary of the emerging hardware-based security trend. The firm identifies eMemory as well positioned to capture demand for security solutions integrated into semiconductor applications.
Accton - The networking equipment manufacturer is highlighted for its potential to profit from increased adoption of switch trays used in scale-up networking for next-generation ASIC servers. Macquarie positions Accton as a supplier aligned with the evolving infrastructure requirements of advanced AI computing systems.
Market implications
Macquarie's selections point to demand not only for chips but also for packaging, security IP, and networking hardware that together enable larger AI deployments. The emphasis is on integrated supply chains that serve AI and HPC customers across design, manufacturing, packaging, and system-level networking.
Notes and limitations
The analysis provided reflects Macquarie's assessments and projections as reported. Where projections are cited, such as MediaTek's AI ASIC contribution and TSMC's HPC exposure, those figures are presented as Macquarie's estimates.