ASML reported that its ability to produce extreme ultraviolet - EUV - lithography systems is almost completely reserved through the end of 2027. In the wake of that update, Chief Financial Officer Roger Dassen told analysts the company sees an opening to lift prices on some of its chipmaking equipment.
On an investor call, Dassen said the current market environment provides "better pricing power" and creates "a pretty strong runway for potential price improvements going forward." He added that discussions about price adjustments are underway with customers and that investors should expect to see gradual improvement over time.
At the same time, reporting earlier in the day indicated friction in negotiations with at least one major foundry customer. A technology news outlet cited people familiar with discussions who said Taiwan Semiconductor Manufacturing Co (TW:2330) has been resistant to proposed price increases. The same report noted that some Chinese buyers had consented to a roughly 10% hike on ASML's lower-end deep ultraviolet - DUV - tool lines.
The comments from ASML's CFO and the market reporting together sketch a mixed picture: strong demand for leading-edge EUV capacity that supports pricing leverage, counterbalanced by selective pushback from significant customers on price changes for certain systems. The company itself framed the situation as an ongoing dialogue with clients, implying that any price improvements would emerge over time rather than instantly.
What this means
ASML's near-term production bookings for EUV equipment underpin the company's argument for stronger pricing. The company's management is actively engaged in pricing conversations with customers, while external reporting highlights differing customer responses depending on the product line and the buyer.
The data points in this report are limited to statements made by the company's CFO and the cited reporting on customer negotiations. There is no additional information on timing, scope, or contract specifics beyond what was disclosed on the call and in the reporting.