Stock Markets May 13, 2026 08:24 AM

UBS: Samsung Set to Close HBM Gap with SK Hynix by 2027 as AI Demand Fuels Shipments

Bank lifts Samsung HBM shipment outlook; SK Hynix forecasts trimmed as it shifts capacity toward DDR5/LPDDR5X

By Nina Shah GOOGL NVDA MU

UBS analysts say Samsung Electronics is positioned to achieve parity with SK Hynix in high-bandwidth memory (HBM) bit market share by 2027, following updated shipment forecasts and recent capital expenditure timing changes. The bank raised Samsung's 2027 HBM shipment estimate and trimmed SK Hynix's forecasts as customers push for DDR5/LPDDR5X capacity. UBS also increased its total HBM demand outlook and HBM average selling price assumptions amid stronger server procurement.

UBS: Samsung Set to Close HBM Gap with SK Hynix by 2027 as AI Demand Fuels Shipments
GOOGL NVDA MU

Key Points

  • UBS kept Samsung's 2026 HBM shipment forecast at 9.7 billion gigabits (124% y/y) and raised its 2027 forecast to 23.0 billion gigabits (137% y/y), citing capex pull-ins.
  • UBS trimmed SK Hynix's HBM shipment forecasts to 17.7 billion gigabits for 2026 (from 18.4) and to 23.1 billion gigabits for 2027 (from 24.7), as the company reallocates capacity toward DDR5/LPDDR5X.
  • UBS projects Samsung and SK Hynix will each hold about 40% of HBM bit market share in 2027, with Micron at about 20%; the bank also raised total HBM demand and ASP assumptions.

Summary

UBS now expects Samsung Electronics to reach market share parity with SK Hynix in the HBM bit market by 2027, driven by stronger-than-expected Samsung shipments and capex pull-ins. The bank adjusted its company-level HBM shipment forecasts and raised its view of total HBM end demand and average selling prices, citing robust demand for AI-related chips and accelerating server procurement.


Shipment revisions and company outlooks

UBS maintained its Samsung HBM shipment projection for 2026 at 9.7 billion gigabits, which represents 124% year-on-year growth. For 2027 the bank increased its estimate to 23.0 billion gigabits, up 137% year-on-year and higher than its prior forecast of 20.3 billion gigabits. The analysts attributed the upward revision in large part to recent capital expenditure pull-ins by Samsung that support a faster ramp in HBM output.

By contrast, UBS trimmed its SK Hynix HBM shipment forecasts. The bank lowered the 2026 estimate to 17.7 billion gigabits from a prior 18.4 billion gigabits, and reduced the 2027 estimate to 23.1 billion gigabits from 24.7 billion gigabits. UBS said the downgrade largely reflects SK Hynix allocating more capacity to DDR5 and LPDDR5X segments in response to ongoing customer demand for those products.

Market share and competitive positioning

With the revised numbers, UBS projects that Samsung and SK Hynix would each account for roughly 40% of the HBM bit market in 2027, leaving Micron with the remaining 20% share. "Samsung could reach market share parity for HBM with SK Hynix by 2027E," analysts led by Nicolas Gaudois said in a note.

End-demand, pricing and broader memory market dynamics

UBS raised its forecast for total HBM end demand to 32.9 billion gigabits for 2026, an increase of 88% year-on-year, and to 58.0 billion gigabits for 2027, up 76% year-on-year. The bank identified higher assumptions for Google TPU unit procurement as the main driver behind the upward revision to aggregate HBM demand.

The bank also flagged a sharp pricing upswing across the broader memory market tied to accelerating server procurement. UBS now expects server DDR contract prices to climb nearly 60% quarter-on-quarter in the second quarter of 2026, versus a previous estimate of 37%, with contract prices possibly reaching $1.95 per gigabit. NAND flash contract pricing is likewise projected to rise about 60% quarter-on-quarter in the same period.

Nvidia assumption changes and supply considerations

On product configuration, UBS adjusted its assumptions for Nvidia's next-generation Rubin Ultra platform, now modeling 768 gigabytes of HBM4E in a 12-high stack, down from a prior assumption of 1 terabyte using a 16-high stack. The analysts noted the picture remains fluid and said the change could reflect Nvidia "pre-empting possible supply constraints at the DRAM die level" as well as yield challenges associated with higher-stack designs.

Pricing assumptions

Reflecting tighter industry dynamics, UBS raised its HBM average selling price assumptions. The bank now forecasts a 30% year-on-year increase for HBM4 and HBM3E in 2027, a clear shift from its earlier assumption of flat pricing for those products.

Implications for stakeholders

These revisions change the near-term competitive and pricing landscape for memory suppliers and for customers procuring large-scale AI compute resources. The updated forecasts influence expectations for revenue and capacity planning across the memory supply chain, including chips used in servers and AI accelerators.


Note: UBS analysts highlighted recent customer-driven demand trends and supplier capacity allocations as the basis for the forecast adjustments. The situation was described as fluid, particularly around supply constraints and stack-yield considerations for next-generation HBM configurations.

Risks

  • Capacity reallocation by major suppliers - SK Hynix's shift toward DDR5/LPDDR5X could alter competitive supply balances and affect HBM availability, impacting the semiconductor sector and cloud AI infrastructure customers.
  • Supply constraints and yield challenges - Potential DRAM die-level constraints and yield issues with higher HBM stacks could disrupt planned product configurations for AI platforms, affecting GPU/accelerator vendors and data center procurement.
  • Volatile contract pricing - Rapidly rising DDR and NAND contract prices driven by server procurement could influence cost structures across server and storage markets and affect customer procurement decisions.

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