Stock Markets July 14, 2026 09:18 AM

Morgan Stanley Calls Broadcom a Core AI Winner, Sees It Keeping Vast Majority of Google TPU Business

Analysts push back on fears MediaTek will displace Broadcom, project large AI revenue contribution for AVGO by fiscal 2027

By Leila Farooq
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Morgan Stanley reiterated an Overweight rating on Broadcom, arguing the company should maintain roughly 80% share of Google's TPU business over time. The bank downplayed scenarios that have MediaTek capturing half of TPU share or fully displacing Broadcom, while highlighting contract-secured HBM supply and packaging execution challenges for MediaTek. Morgan Stanley also forecasted roughly $120 billion in AI revenue for Broadcom in fiscal 2027, with about $80 billion tied to TPU products.

Morgan Stanley Calls Broadcom a Core AI Winner, Sees It Keeping Vast Majority of Google TPU Business
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Key Points

  • Morgan Stanley reaffirmed an Overweight rating on Broadcom and expects it to keep roughly 80% share of Google's TPU business over time.
  • The firm said "MediaTek participation is real, but not disruptive," comparing the situation to last years Marvell/Alchip concerns around Amazons Trainium.
  • Morgan Stanley projects roughly $120 billion in AI revenue for Broadcom in fiscal 2027, with about $80 billion tied to TPU products, while expecting TPU share of AI revenue to fall to about 60% as other ASIC customers scale.

Morgan Stanley on Tuesday reaffirmed an Overweight rating on Broadcom, signaling confidence in the chipmaker's position in cloud AI hardware despite investor concerns that MediaTek could take a large chunk of Google's TPU business.

Analyst Joseph Moore told investors that Morgan Stanley expects Broadcom to retain roughly 80% TPU share over time, calling bearish forecasts of 50% share or eventual displacement "premature." The firm said "MediaTek participation is real, but not disruptive," drawing a parallel to last years Marvell/Alchip situation around Amazons Trainium chip, where fears of total displacement similarly proved exaggerated.

Morgan Stanley acknowledged that MediaTek presents a credible threat in the context of Googles cost-conscious procurement and desire for multiple suppliers. Still, the bank argued that meaningful cost savings may be hard to achieve in practice, particularly with respect to high-bandwidth memory (HBM). The note states Broadcom has already secured HBM supply under existing contracts, which could blunt MediaTeks potential advantages on component costs.

The firm also highlighted execution risk tied to MediaTeks packaging approach. Morgan Stanley reported its Taiwan semiconductor team expects MediaTek to rely on CoWoS capacity for 2nm TPU production, and warned that EMIB packaging technology remains unproven at the scale Google requires.

On the revenue outlook, Morgan Stanley estimated Broadcom will generate roughly $120 billion in AI revenue in fiscal 2027, with TPU-related revenue around $80 billion. The note also forecasted that TPUs portion of total AI revenue would decline to about 60% as newer ASIC customers ramp production.

Morgan Stanley framed Broadcom as a leading AI compute name and one of its preferred semiconductor growth stories. In the research note the firm said, "AVGO remains one of our preferred AI compute names and a close #2 behind NVIDIA." The firm added: "We view Broadcom as one of the best growth stories in semis, supported by its leadership in custom ASICs, strong networking franchise, increasing AI revenue diversification, and a management team we trust to execute through product transitions."


Implications for markets and sectors

  • Semiconductor sector - The note supports the view that Broadcom will remain a dominant supplier for large-scale TPU deployments.
  • Cloud infrastructure and hyperscalers - Google's TPU sourcing dynamics and supplier optionality are central to the debate.
  • AI compute supply chain - HBM memory contracts and packaging technologies are key operational levers that affect competitive positioning.

Risks

  • Potential execution risk for MediaTek's packaging strategy - EMIB packaging is described as unproven at the scale Google requires, while MediaTek is expected to rely on CoWoS capacity for 2nm TPU production. - Impacts semiconductor and cloud hardware sectors.
  • Constraints around HBM memory cost advantages - Broadcom has secured HBM supply under existing contracts, which could limit MediaTek's ability to undercut on memory costs. - Impacts component suppliers and AI infrastructure economics.
  • Market overhang from the MediaTek / TPU debate - Investor concern that MediaTek could capture 50% TPU share or displace Broadcom is labeled premature, but the debate remains an investor risk factor. - Impacts semiconductor equities and cloud supplier dynamics.

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