ASML said its expansion roadmap for 2027 and 2028 incorporates demand from the planned Terafab chip plant in Texas, the company’s finance chief said on a conference call. The comments make clear that customer construction plans - including Elon Musk’s Terafab project - are being accounted for in ASML’s medium-term capacity planning.
"We’re in dialogue with all our customers and we know ... what their building plans are," Chief Financial Officer Roger Dassen said, adding explicitly that "Terafab is also part of those plans." The remark ties ASML’s equipment supply outlook directly to visible customer investments in new fabrication capacity.
Dassen provided additional detail on ASML’s technical product flows, noting that shipments of high-numerical aperture extreme ultraviolet (EUV) lithography systems have been limited to the low-single digits worldwide. These next-generation EUV tools represent the advanced end of ASML’s portfolio.
On broader market dynamics, Dassen said that if China is unable to expand its domestic chipmaking capacity, production would relocate to other regions because global demand for semiconductors remains unchanged. That view frames ASML’s capacity planning as responsive to where fabs are built rather than to regional constraints.
Regarding future bookings, ASML indicated it is close to filling its available EUV capacity for 2027 and has already secured a substantial share of orders for 2028. Taken together, those statements suggest near-term capacity utilization is strong while some demand is already committed further out.
Contextual note: The comments were made on a company call and reflect ASML’s current assessment of customer build-out timing and equipment demand for its EUV systems.