Economy June 10, 2026 04:50 AM

Morgan Stanley Sees AI-Driven Corporate Debt Surging Toward $570 Billion in 2026

Brokerage warns rising bond supply as hyperscalers and chip makers turn to markets to fund heavy AI-related capital spending

By Hana Yamamoto
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Morgan Stanley projects AI-related global debt issuance will climb to nearly $570 billion in 2026, driven by hyperscaler capital expenditure and increased bond supply. The bank reports issuance already near $236 billion as of May 31, 2026, and expects issuance to accelerate in the second half of the year as outlays intensify and hyperscaler capex moves toward a $1 trillion-plus trajectory in 2027.

Morgan Stanley Sees AI-Driven Corporate Debt Surging Toward $570 Billion in 2026
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Key Points

  • Morgan Stanley forecasts AI-related global debt issuance will reach nearly $570 billion in 2026, more than doubling from current levels.
  • AI-related issuance stood at nearly $236 billion as of May 31, 2026, about four times the amount at the same point last year; hyperscalers are expected to spend $700 billion in outlays this year.
  • Issuance is expected to accelerate in H2 2026 as hyperscaler capex rises toward and beyond $1 trillion in 2027; sectors impacted include corporate bond markets, technology companies (hyperscalers), and semiconductor firms.

Morgan Stanley forecasts that debt tied to artificial intelligence investments will more than double, reaching almost $570 billion in 2026 as major technology firms tap credit markets to fund large-scale capital spending. The brokerage points to rising bond supply and growing credit market activity as hyperscalers seek alternative financing to support AI-driven outlays.

According to Morgan Stanley's estimate, AI-related global debt issuance stood at nearly $236 billion as of May 31, 2026 - roughly four times the level recorded in the same period a year earlier. That surge reflects a shift by technology companies that historically relied on strong cash flows but are increasingly turning to debt financing as investment needs escalate.

Hyperscalers Alphabet, Amazon, Microsoft and Meta are expected to mobilize approximately $700 billion in total outlays this year, the brokerage said. Morgan Stanley also anticipates issuance will pick up pace in the second half of 2026 as hyperscaler capital expenditure trends toward a longer-term trajectory, with the firm projecting hyperscaler capex to top $1 trillion in 2027.

Morgan Stanley highlighted that these large issuers are widening their investor reach. "Hyperscalers have been broadening their investor base through non-USD issuance," the brokerage said, noting the trend toward diversifying funding sources beyond traditional dollar-denominated markets.

On market dynamics, Morgan Stanley emphasized that while underlying economic fundamentals remain solid, near-term bond pricing appears to be influenced largely by expectations around supply. "Fundamental (economic) backdrop remains strong, but for now we think (bond) price action is being mostly driven by supply expectations," the firm added.

The report also draws attention to financing trends in the semiconductor sector. Financing for chip companies - which is rising in both public and private markets - is shifting toward shorter-duration arrangements, structured so that deals are paid down fully over time. This reflects a different funding cadence than the longer-term issuance now seen in some technology balance sheets.

Overall, Morgan Stanley's outlook frames a debt market responding to rapid, concentrated capital demands tied to generative AI and related infrastructure, with implications for bond supply, investor composition and issuance timing as corporations adjust financing strategies to match scaling investment needs.

Risks

  • Increased bond supply is influencing bond price action, which could create volatility in fixed income markets and affect yield dynamics - impacting bond investors and corporate borrowers.
  • A shift to shorter-term financing in the chip sector may raise refinancing frequency and exposure to market conditions, affecting semiconductor firms' funding stability.
  • Broadening investor bases through non-USD issuance could expose issuers and investors to currency and regional market risks tied to non-dollar-denominated bonds.

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