TSMC to Push Smaller, Faster Chips Using Existing EUV Machines, Avoiding Costly High-NA Shift
Taiwan Semiconductor Manufacturing Co announced two new process variants designed to deliver denser and quicker chips without adopting ASML's much more expensive high-NA EUV tools. The company detailed an A13 node slated for 2029 and a lower-cost N2U option for broader device classes, while also outlining plans to stitch many more compute dies and …