TSMC intends to commence equipment installation and move to volume production of chips using its 3-nanometre process at the company's second fabrication facility in Japan in 2028, according to a Taiwanese government filing filed late on Tuesday. The timeline and production target were outlined in the filing and reflect an updated plan for the site.
In February, TSMC's chief executive CC Wei told Japan's Prime Minister Sanae Takaichi that the company planned to mass-produce advanced 3-nanometre chips at the second Japanese fab. That statement is consistent with the details contained in the more recent government filing.
Under the revised blueprint documented in the filing, the second plant in Japan is slated to reach a monthly output of 15,000 12-inch wafers manufactured on the advanced 3-nanometre process technology. The filing stated this capacity figure explicitly.
TSMC's earlier plans for its Japanese operations centered on less-advanced nodes. In 2024, the company said total investment across its first and second Japanese fabs would exceed $20 billion. At that time, TSMC reported a combined monthly capacity goal of 100,000 12-inch wafers employing less-advanced process technologies, specifically 40, 22/28, 12/16 and 6/7-nanometre nodes.
Japanese media reports in February, citing Yomiuri, indicated that investment for the second fabrication plant could be approximately $17 billion. TSMC has not confirmed that figure and declined to comment on the reported investment amount, according to available information.
The company's first fabrication plant in Japan began volume production in late 2024. The Japan unit, established in 2021 as Japan Advanced Semiconductor Manufacturing, was formed with support from Sony Semiconductor Solutions Corporation. Later, Japan's DENSO Corporation and Toyota Motor Corporation joined as minority investors in the unit.
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Contextual note: The reporting above is based strictly on details provided in the Taiwanese government filing and related statements cited in February; no additional projections or external analysis have been introduced.