Stock Markets May 8, 2026 01:45 PM

Apollo and Blackstone in Talks to Back $35 Billion Broadcom AI Chip Financing

Private credit lenders reportedly weighing a massive deal to fund Broadcom's AI chip production and related infrastructure partnerships

By Maya Rios AVGO BX APO

Apollo Global Management and Blackstone are reported to be negotiating roughly $35 billion in financing with Broadcom to support the chipmaker's production of AI-focused processors. The proposed transaction would be among the largest private credit deals on record. Terms remain under negotiation, and the talks come after Broadcom disclosed multi-year agreements with Google and an expanded partnership with Google and Anthropic for TPU-based AI capacity.

Apollo and Blackstone in Talks to Back $35 Billion Broadcom AI Chip Financing
AVGO BX APO

Key Points

  • Apollo Global Management and Blackstone are reported to be negotiating roughly $35 billion in financing with Broadcom to support AI chip production.
  • The proposed package would be among the largest private credit transactions on record, aimed at deploying capital for AI-focused processors and related infrastructure.
  • The talks follow Broadcom's April disclosures of long-term contracts with Google for custom TPUs and networking through 2031, and an expanded partnership with Google and Anthropic to provide an additional 3.5 gigawatts of TPU-based capacity starting in 2027, contingent on Anthropic's commercial performance.

Overview

Two major private equity firms, Apollo Global Management Inc. and Blackstone Inc., are reported to be in talks with Broadcom Inc. over a potential financing package of approximately $35 billion to underwrite the chipmaker's development and production of processors aimed at artificial intelligence workloads. Sources characterize the talks as ongoing and say terms remain subject to negotiation and possible change.


Scale and purpose

If completed on the size reported, the financing would rank among the largest private credit transactions ever arranged. Broadcom is said to be seeking funds specifically to support production of chips designed for AI applications, aligning capital plans with the company's recent commercial agreements in the AI ecosystem.


Contracts and partnerships

In a regulatory filing in April, Broadcom disclosed it had entered into a long-term agreement to develop and supply custom tensor processing units - TPUs - for Google. The filing also referenced a separate contract to provide networking and other components for Google's next-generation AI racks through 2031. Broadcom additionally announced an expanded collaboration with Google and Anthropic to provide Anthropic access to an additional 3.5 gigawatts of next-generation TPU-based AI compute capacity beginning in 2027, subject to Anthropic's ongoing commercial performance.

At the time of those announcements, Broadcom stated that the companies involved were in discussions with financial partners to support the deployment of the announced capacity and infrastructure.


Context from comparable financing

The reported Broadcom talks follow large-scale private financings for AI infrastructure in the prior year, including a nearly $30 billion financing arranged last year for Meta Platforms Inc.'s data center facility in Louisiana, provided by Blue Owl Capital Inc. and Pacific Investment Management Co.


Status and caveats

All reported discussions about the roughly $35 billion financing are described as preliminary and negotiable. No definitive agreement has been reported, and parties are said to be continuing talks on terms.

Risks

  • Terms of the financing remain under negotiation and could change, creating uncertainty about whether a deal will be completed - this affects private credit and leveraged finance markets.
  • The Broadcom-Google and Broadcom-Google-Anthropic deployment plans are contingent on commercial performance and contractual conditions, introducing execution risk for AI infrastructure build-out - this impacts the semiconductor and cloud infrastructure sectors.
  • Large-scale private credit arrangements of this magnitude carry market and underwriting risk, which could influence investor appetite and pricing in the private credit and institutional lending markets.

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